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70 Results for 'Design & fabrication'
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Technology
New Surface-Modifying Film for BCP Formation
Block copolymers (BCPs) self-assemble into well-defined, highly regular and dense nanostructures. Such BCP arrays are useful for fabricating electronic devices like magnetic storage media, quantum dot...
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Padma Gopalan, Eungnak Han, Myungwoong Kim | P130124US01
Technology
Flexible Thin-Film Transistors Are Doped and Strained
Fast, flexible electronics operating at radio frequencies (greater than 1 GHz) are attractive because of their versatility, power savings and wide applicability. Uses include wireless and high-speed c...
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Zhenqiang Ma, Max Lagally, Jung-Hun Seo | P130145US01
Technology
Smoother Waveguides for More Efficient Nonlinear Frequency Conversion
For many applications – from remote sensing to laser displays – it is necessary to convert the frequency of light via nonlinear interaction in semiconductor materials. Waveguide devices accomplish...
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Dan Botez, Thomas Kuech, Luke Mawst, Steven Ruder | P120326US01
Technology
Semiconductor Interconnect Design for Small, Inexpensive, Integrated Current Sensing with Improved Reliability
Semiconductors, which regulate power flow in many modern electronic devices, use interconnects such as bond wires or lead frames to integrate different components: chip, substrate and terminals. Inter...
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Robert Lorenz, Patrick Schneider, Jonathan Hoffman | P120254US01
Technology
Making Large-Scale Nanopatterned Arrays by Streamlined Roll-to-Roll Printing
Promising advances in areas like solar cells and photonic crystals are utilizing optical components with nanoscale dimensions. Unique in their ability to collect and manipulate light, these structures...
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Kevin Turner, David Grierson | P120088US01
Technology
Low-Noise, Phase-Insensitive Linear Amplification at Microwave Frequencies
Rapid development of superconducting quantum electronics has motivated a search for quantum-limited amplifiers for the low-noise readout of qubits and linear cavity resonators. Conventional approaches...
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Robert McDermott, David Hover, Guihem Ribeill, Yung-Fu Chen | P120028US01
Technology
Low-Temperature Method for Smoothing the Disordered Edges of Graphene
Graphene possesses tremendous electrical properties, making it suitable for numerous applications. The current method of fabricating this material involves growing or isolating a full sheet of graphen...
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Michael Arnold, Padma Gopalan, Nathaniel Safron, Myungwoong Kim | P110246US01
Technology
Method to Manage Active Leakage Power in Power Gated Integrated Circuits
Managing power consumption of integrated circuits such as microprocessors is important for conserving energy, improving battery life and reducing issues with device cooling. A common method to reduce ...
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Nam Sung Kim | P110120US01
Technology
High-Frequency Bridge Suspended Diode for Power Generation from High Frequency Microwave Sources
Diodes are two-terminal electrical devices that only allow electrical current to flow in one direction. Diodes are used often in electrical circuits to extract a direct current from an alternating cur...
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Robert Blick, Chulki Kim, Jonghoo Park | P100160US01
Technology
Metal Silicide Nanowires and Methods for Their Production
As electronic gadgets continue to get smaller, tiny metal silicide nanowires may one day be used as fundamental building blocks in devices from cell phones to lasers. Metal silicides already are int...
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Song Jin, Andrew Schmitt, Yipu Song | P06215US
Technology
Fabrication of Magnetic Tunnel Junctions with Epitaxial Ferromagnetic Layers
Tunneling magneto-resistive (TMR) read heads are the next generation in magneto-resistive readers for hard drive disks. TMRs typically include a magnetic tunnel junction (MTJ) that is composed of an o...
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Y. Austin Chang, Jianhua Yang | P05049US
Technology
Efficient Statistical Timing Analysis of Circuits
For integrated circuits, including very large scale integration (VLSI) circuits, to work properly, the signals traveling along the gates and interconnects must be properly timed. Using classical case ...
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Lizheng Zhang, Chung-Ping Chen, Yu Hen Hu | P04377US
Technology
Determining Film Stress from Substrate Shape Using Finite Element Procedures
The fabrication of semiconductor devices involves growing thin films on wafers and patterning them. However, thin films typically exhibit intrinsic stress, which can lead to failure of electronic devi...
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Edward Lovell, Roxann Engelstad, Zhaohua Feng | P03143US
Technology
Fabrication of Oxide Barriers Using Selective Oxidation of Metallic Thin Films
Tunneling magneto-resistive (TMR) read heads are the next generation in magneto-resistive readers for hard drive disks. TMRs typically include a magnetic tunnel junction that is composed of an oxidize...
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Y. Austin Chang, Jianhua Yang, Peter Ladwig | P04250US
Technology
PIN Diodes for Fast Photodetection, and High-Speed, High-Resolution Imaging and Sensing
PIN diodes are semiconductor devices that include an undoped intrinsic semiconductor region between the p-type and n-type regions. These diodes are commonly integrated as photodetectors on silicon CMO...
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Max Lagally, Zhenqiang Ma | P04389US
Technology
Progressive Random Access Scan Circuitry
Very large scale integrated (VLSI) circuits are tested before use to evaluate reliability and performance. The two most common testing methods are serial-scan and random access scan (RAS). The serial...
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Kewal Saluja, Dong Hyun Baik | P06048US
Technology
Method for Improving Plasma Processes by Controlling a Voltage Waveform
The semiconductor industry fabricates integrated circuits (IC) through a series of plasma processes that involve etching lines and spots, as well as depositing thin films of materials and modifying su...
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Amy Wendt | P06468US
Technology
Multilayer Si/SiO2 Semiconductors for Photoelectric Device Fabrication
Computer chips, composed of silicon (Si) semiconductors, store and transmit information as electrons. The negative charge on electrons, however, hinders the speed with which information can be trans...
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Mark Eriksson, Max Lagally, Arnold Kiefer | P06013US
Technology
Method for Fabricating High-Speed Thin-Film Transistors
Thin-film transistors often use a single-crystal layer of silicon semiconductor attached to a flexible plastic substrate to allow flexibility in the electronics. However, transistors using some types ...
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Zhenqiang Ma, Hao-Chih Yuan, Guogong Wang | P06456US
Technology
Thin-Film Semiconductor for Increasing Microprocessor Speeds
Complementary metal-oxide semiconductor (CMOS) technology is commonly used in integrated circuits for microelectronics. Current is produced in semiconductor devices by using mobile charge carriers, ei...
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Max Lagally, Shelley Scott, Donald Savage | P07485US